均热板专利
CT Electronics拥有与其创新的均热板设计相关的关键性专利，包括：
| Date | Jurisdiction | Patent Name | Patent Number |
| 9 Oct 2001 | United States | Electro-Optical Package for Reducing Parasitic Effects | US 6,301,401 B1 |
| 11 Oct 2001 | Taiwan ROC | An Electrical Optical Package for Reducing Parasitic Effects | 144148 |
| 2 May 2003 | Taiwan ROC | Semi Conductor Package | 169690 |
| 11 May 2003 | Taiwan ROC | Laminated Heat Trasfer Device and Method of Producing Thereof | 177009 |
| 15 May 2003 | Japan | Vapor Augmented Heatsink with Multiwick Structure | 4427445 |
| 16 Dec 2003 | United States | Semi Conductor Package | US 6,664,617 B2 |
| 14 Mar 2006 | HKSAR | Heat Transfer Device and Method of Manufacturing the same | HK1080543 |
| 11 May 2007 | Taiwan ROC | Vapor Chamber with Boiling Enhanced Multi Wick Stucture | I281017 |
| 11 Feb 2008 | Taiwan ROC | Vapor Augmented Heatsink with Multiwick Structure | I293361 |
| 28 May 2008 | PRC | Heat Transfer Device and Manufacturing Method | ZL 03 8 16747.6 |
| 9 Sep 2008 | United States | Vapor Augmented Heatsink with Multiwick Structure | US 7,422,053 B4 |
| 1 Aug 2009 | Taiwan ROC | Method of Manufacturing Heat Transfer Device | I312858 |
| 26 Jan 2010 | United States | Vapor Augmented Heatsink with Multiwick Structure | US 7,650,931 B3 |
| 16 Jun 2010 | PRC | Vapor Chamber with Boiling Enhanced Multi Wick Stucture | ZL200580034762.2 |
科技文章
李汉强博士曾发表大量与均热板技术相关的论文，并在多个主要科技论坛发表演说，详情包括：
- Lee, S. H. -K., Choi, C. C. C., Jaluria, Y., "Cooling Enhancement of a Multi-Wick Vapor Chamber", Pan Pacific MicroElectronics Symposium, SMTA, Maui, Hawaii, 2007
- Lee, S. H. -K., Chu, S. K., Choi, C. C. C., Jaluria, Y., "Performance Characteristics of Vapor Chambers with Boiling Enhanced Multi-Wick Structures", Semi-Therm Symposium, IEEE, San Jose, 2007
- Lee, S. H. -K., Chu, S. K., Choi, C. C. C., Jaluria, Y., "Numerical Study on the Cooler optimization - Conventional Heat Sink vs. Vapor Chamber", Technology Forum and Exhibition, AMD, Taipei, 2007
- Lee, S. H. -K., Chu, S. K., Choi, C. C. C., Jaluria, Y., "Application of Vapor Chamber in Electronics & Comparison with Solid Heatsink", Thermal Management & Technology Symposium, WebCom, Austin, 2008